Wearable mobile devices, or simply wearables, can monitor people’s physiological conditions in a real-time, reliable, and non-invasive manner. They are considered as viable replacements to smartphones for a more natural physiological monitoring. Besides, by incorporating the environment and activity information, wearables can provide more value-added services including the physical and mental healthcare, wellness, entertainment, localization and navigation, user authentication and identification, etc. The research as well as commercialization in this area are becoming more and more significant due to the global population aging issue. According to a recent report by Mordor Intelligence, the wearables’ global market was valued at USD 27.91 billion in 2019 and is expected to reach USD 74.03 billion by 2025, at a compound annual growth rate of 17.65%.
Technically, the rapid development of the wearables is concomitant with the emergence of enabling technologies including sensors, micro-electromechanical systems (MEMS), signal processing, wireless communications, mobile and edge computing, integrated circuits, and artificial intelligence. This dramatic growth is impacting several scientific and engineering application domains. However, when designing the wearable systems, there are several features or constraints needed to be taken into account such as the sensing and computing efficiency, accuracy and reliability, data storage and security, communication and networking strategy, power consumption, form factor, flexibility, manufacturing cost, bio-compatibility, and so on. In this context, many of the aforementioned techniques should be reformed or customized to fulfill such practical requirements, which creates broad scientific research opportunities for many traditional communities.
The intent of this special issue is to invite scholars, researchers, engineers and other innovators to collectively display their state-of-the-art knowledge and their cutting-edge innovations in the areas of signal processing, data analysis, and computing for the wearable technology and related emerging devices. Review papers on these topics are also welcome. The authors are encouraged to contact the guest editors to ensure that their contribution falls within the scope of this special issue.
Topics of interest in this special issue include, but are not limited to:
Sensing and Signal Processing for Wearables
Data acquisition, signal processing, and data analysis for wearables
Advanced signal processing and customized circuits for vital sign sensing
Signal processing for motion and gesture detection and classification
User identification and authentication via wearables
Security and privacy issues in wearables
Big data analysis for wearables
Edge or mobile computing for wearables
Machine/Deep/Federated learning in wearables
Wearable system design, wearable sensors, actuators, input/output devices
The submission portal will be opened: Oct. 20, 2020
Submission deadline: Jan. 31, 2021
Review completion dates (First-Round): Mar. 31, 2021
Revision and second-round review (if required): Apr. 30, 2021
Notification of acceptance: May 7, 2021
Final manuscript due: May 15, 2021
Publication of the special issue: Jul. 2021
Manuscript Submission Information:
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers where at least 30% of new content is required). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Guide for Authors page (https://www.journals.elsevier.com/digital-signal-processing).
Dr. Wenbo Ding (Lead Guest Editor), Tsinghua-Berkeley Shenzhen Institute, Tsinghua University, China. Email: firstname.lastname@example.org
Dr. Amir H. Alavi, Department of Civil and Environmental Engineering, Department of Bioengineering, University of Pittsburgh, USA. Email: email@example.com
Dr. Guillermo Botella, Department of Computer Architecture and Automation, Complutense University of Madrid, Spain. Email: firstname.lastname@example.org
Dr. Francesco Fioranelli, Department of Microelectronics, TU Delft, Netherlands. Email: email@example.com
Dr. Gang Li, Department of Electronic Engineering, Tsinghua University, China. Email: firstname.lastname@example.org
Dr. Xiaoyue Ni, Department of Mechanical Engineering and Materials Science, Duke University, USA. Email: email@example.com