Physical Layer Technologies for 6G Wireless Communications: Key Drivers and Research Challenges

in Special Issue   Posted on September 28, 2020 

Information for the Special Issue

Submission Deadline: Mon 15 Feb 2021
Journal Impact Factor : 1.594
Journal Name : Physical Communication
Journal Publisher:
Website for the Special Issue:
Journal & Submission Website:

Special Issue Call for Papers:

The number of connected devices worldwide is expected to reach 50 billion at the end of 2030 according to the latest research reports (Source: Strategy Analytics), and the wireless data traffic is estimated to reach 4394 EB (Source: ITU). Most of the future data-intensive applications handling a massive number of connected devices will demand high data rates with low latency. To deliver these demands and customer expectations, current 5G technologies must be further developed in line with the 6G concepts. The 6G system will increase the performance and maximize the user quality of Service (QoS) several folds more than 5G along with some additional benefits.

Research in 6G has already begun and is expected to gain momentum very soon. Industries and academia have allocated enormous funds and other resources for 6G research and development. With the introduction of new use cases such as Ultra-Reliable Low Latency Communication (URLLC) and Massive Machine Type Communications (MMTC), one of the primary focus is to use Artificial Intelligence techniques especially Machine Learning to develop adaptive, dynamic and self-learning systems for the physical layer in B5G and 6G. This special issue will solicit high-quality papers reporting on new techniques and concepts, standards, issues, challenges, and promising solutions for the physical layer in 6G wireless communication. Topics of interest for this special issue include, but are not limited to,

  • Key drivers and physical layer requirements for 6G wireless communication
  • Physical layer security issues and challenges
  • Artificial Intelligence assisted technologies for 6G physical layer
  • Physical layer technologies supporting 6G enabled massive IoT
  • Novel coding and modulation techniques
  • Advanced communication technologies and physical layer standards
  • Millimetre-wave technologies for 6G
  • Physical layer authentication and location verification in 6G
  • Massive MIMO systems for 6G networks
  • Physical layer heterogeneous networks
  • 6G testbeds and experimentation
  • Non-orthogonal multiple access (NOMA) techniques for 6G
  • Breakthrough technologies and concepts
  • Ultra-dense cell communication and channel modelling
  • Future perspectives on the physical layer for 6G wireless communications


Important Dates:

Submissions Deadline: July 30, 2020

First Reviews Due: October 30, 2020

Revision Due: December 15, 2020

Acceptance Notification: January 15, 2021

Final Manuscript Due: February 15, 2021

Publication Date: 2021




All submitted papers must be clearly written in excellent English and contain only original work, which has not been published by or is currently under review for any other journal or conference. Papers must not exceed 25 pages (one-column, at least 11pt fonts) including figures, tables, and references. A detailed submission guideline is available as “Guide to Authors” at:

All manuscripts and any supplementary material should be submitted through Editorial Manager at The authors must select this special issue name when they reach the “Article Type” step in the submission process.

All papers will be peer-reviewed by three independent reviewers. Requests for additional information should be addressed to the guest editors.



Guest Editors:

Dr. Varun G Menon (Lead GE)

ACM Distinguished Speaker, Senior Member IEEE

Department of Computer Science and Engineering,

SCMS School of Engineering and Technology, India

Email: [email protected]


Dr. Shahid Mumtaz, Ph.D., CEng.

Senior Researcher, Senior Member IEEE

ACM Distinguished Speaker

Editor in Chief – IET Journal of Quantum Communication

Instituto de Telecomunicaces, Aveiro, Portugal

Email: [email protected]


Dr. Miaowen Wen

School of Electronic and Information Engineering

South China University of Technology, Guangzhou, China

Email: [email protected]



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