The Intelligent Internet of Things (IoT) tsunami is affecting every aspect of our daily lives, ranging from smart cars, homes, cities and factories to smart health and environments. To enable this transformation and to better understand the untapped opportunities, the interdisciplinary landscape of IoT demands a large number of significant technological advancements in the hardware and software communities to come together and to synergize their efforts.
This Special Issue will be devoted to the selected high-quality papers of International Conference on Omni-layer Intelligent systems (COINS) 2019. The focus of this SI is on novel omni-layer techniques for smart IoT systems. In particular, we would like to address all-important aspects of novel IoT technologies from Connected Devices, to Edge/Fog, Cloud, and application, covering manufacturing, materials, CMOS and beyond-CMOS devices, architecture, embedded systems, reconfigurable hardware, network, cloud, Omni-layer artificial intelligence and machine learning, big data, emerging applications, as well as human-machine interaction, achieving the goal of accuracy, privacy, reliability and security.
Please submit your extended paper, as soon as possible, but no later than September 1, 2019. All manuscripts and any supplementary material should be submitted to the COINS 2019 Special Issue (NOT to any regular or other special issue) via the Elsevier online system of the journal, available at https://www.evise.com/profile/api/navigate/MICPRO.
Each manuscript should include the complete paper text, all illustrations, and references. Please see the submission instructions on the web site. Please also note that the extended papers must contain at least 30% of new material different from the original work published in COINS conference, should have a tutorial value and include clear explanations made when using a high-quality graphical material (figures, graphs, etc.).
Submission deadline: 1 September 2019
Author notification: 01 October 2019
Revisions due by: 01 November 2019
Final Notification: 15 November 2019
Managing Guest Editor
Prof. Eugenio Villar, Univ. of Cantabria, email@example.com
Dr.-Ing. Farshad Firouzi, mVISE AG, firstname.lastname@example.org
Prof. Krishnendu Chakrabarty, Duke University, email@example.com
Dr. Bahar Farahani, Shahid Beheshti University, firstname.lastname@example.org
Dr. Fangming Ye, Huawei, Fangming.Ye@huawei.com
Dr. Vasilis Pavlidis, University of Manchester, email@example.com
For any information or communication please refer to this address: firstname.lastname@example.org