Topic of the special issue
Mobile systems technologies encompass a range of solutions spanning from the bare hardware/firmware up to the design of applications fully aware of the requirements and constraints of a “mobile” world.
Examples of systems belonging to this applicative area are smartphones, tablets, phablets, smartwatches, mobile and wearable systems (including medical ones). The enabling technologies, in addition to low power processing units, are those related to the emerging memory technologies, the efficient implementation of wireless protocols and novel design strategies that consider in a joint perspective performance, energy, dependability, security and functionalities.
This special issue is soliciting submissions on the following main topics, although any other contribution in the field of “Mobile Systems” is similarly welcome:
Storage and memory systems: trends and solution tailored for a mobile world
Near zero computing and power aware mobile applications
Designing and tuning Hw and Sw for mobile systems
Multi-many cores for the new generation of mobile devices
Graphic processing and QoS management
Security, privacy and dependability in mobile systems
Cooperative mobile systems
System software for mobile devices
Integration of mobile technologies and IoT
Case studies and design experiences
All submitted papers must follow the guidelines of the journal, see https://www.elsevier.com/journals/microprocessors-and-microsystems/0141-9331/guide-for-authors for more information
The article length is expected to be in the range of 6-12 pages.
If the paper is an extended journal version of a conference paper, at least 30% of new text is required and the source paper must be properly referenced.
William Fornaciari (Politecnico di Milano, firstname.lastname@example.org)
Luca Breveglieri (Politecnico di Milano, email@example.com)
Paolo Amato (Micron Technology, Inc., firstname.lastname@example.org)
Mariagiovanna Sami (Politecnico di Milano, email@example.com)
Deadline for submission: November 30, 2017
Notification of acceptance: January31, 2018