Industry 4.0 and Smart Manufacturing

  in Special Issue   Posted on December 18, 2020

Information for the Special Issue

Submission Deadline: Sun 28 Feb 2021
Journal Impact Factor : 3.275
Journal Name : Sensors
Journal Publisher:
Website for the Special Issue: https://www.mdpi.com/journal/sensors/special_issues/Industry_Smart_Manufacturing
Journal & Submission Website: https://www.mdpi.com/journal/sensors

Special Issue Call for Papers:

Special Issue Information

Dear Colleagues,

The current COVID-19 pandemic has exposed the vulnerability of production networks across the globe. For the first time, global production networks have to restart after a worldwide stop. One of the key questions in this context is: How smart are our production and logistic networks now? A key component of this ramp-up will be reliable data collection, data processing, and data exchange.

While this Special Issue is not strictly focused on investigating countermeasures for the current crisis in production scenarios, it addresses related topics such as improved agility, resilience, and scalability based on the concepts commonly referred to as Industry 4.0 and Smart Manufacturing. We welcome papers concerning applied research in these fields which prove the advancements in data-centric production and logistic networks. Topics of interest include but are not limited to:

Industry 4.0;
Industrial Internet;
Industrial applications of the Internet of Things;
Smart Manufacturing;
Smart logistics related to industrial applications;
Cyberphysical systems;
Smart Factory, including industrial building automation;
Remote access, remote maintenance, remote laboratories;
Industrial sensor networks;
Combinations of sensors/sensor networks and Augmented Reality in industrial environments;
Automatic object identification (e.g., RFID);
Real-time locating in production and logistics;
Object recognition and automatic object classification in Smart Factories;
Artificial intelligence for industrial applications;
Educating the Industry 4.0 generation.

Prof. Dr.-Ing. Dieter Uckelmann
Guest Editor

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