Embedded electronic systems contain a combination of software and hardware, both analog and digital. Although simple systems can be implemented with a single, off the-shelf microcontroller, a digital signal processor or a conventional microprocessor and associated software, more complex systems that have critical requirements regarding aspects such as area, speed, and power consumption call for innovative design. Various target architectures can be considered for matching different requirements. Solutions may include dedicated processors and/or ASICs, or even multi-processor platforms, combined with dedicated analog and RF front ends. The design of such complex embedded systems and analog front ends encompasses a suite of different technologies, tools, and design styles. A complete design environment must consider system specification, partitioning among software, digital hardware and analog parts, and synthesis of software and hardware parts and interfaces.
As the penetration of internet-based services such as video streaming, broadband connections have become an increasingly indispensable element of modern life, so the demand for advanced network technologies is growing stronger than ever. The dynamic 5G technology is one such concept anticipated to make a significant mark over the coming years. Indeed, it has resulted in the evolution and advancement of several verticals such as 5G chipsets, 5G enterprises, 5G broadcast, and more.
Defined with faster speed, increased bandwidth, higher capacity and low latency issues, 5G is likely to contribute to the several technological breakthroughs in fields ranging from smartphones and IoT connected devices to smart cities and autonomous cars. An important consideration in the growth of this technology is the establishment of a robust 5G infrastructure. 5G chipsets are an integral part of this infrastructure, which is why several vendors across the technological domain are showing a strong commitment towards developing sophisticated chipset solutions. 5G chipsets refer to a set of electronic elements within integrated 5G circuits, which facilitate the transmission of 5G packets on IoT devices, smartphones, portable hotspots, and even mobile network-equipped notebook PCs.
6G will eventually replace 5G, but currently 6G is not a mature technology, and is instead in the early research phase. Mobile telecoms companies are much too focused on 5G to deal with 6G in any significant way at the moment, and for the near future.
In this context, this special issue offers a platform for researchers and practitioners worldwide to present their novel and innovative ideas on design methodologies for integrated 5G/6G technologies. We invite unpublished articles presenting interactive system models, conceptual designs, and technological advancements related to the theme of this special issue.
Potential topics included, but not limited
Embedded systems in software defined radio for 5G/6G applications
On chip reconfigurable antennas and devices for 5G/6G communication systems
Reconfigurable FPGA programming model architecture for 5G layers
Design and implementation of embedded hardware switch for 5G/6G network architecture
Novel packing and system integration platform for low cost and high performance 5G/6G systems
Design and implementation of microservice architecture for 5G/6G satellite edge computing framework and its applications
Hardware prototyping for filter bank multicarrier for 5G/6G mobile communication systems
Design and integration of receiver circuits for 5G/6G communication systems
Architecture design of area efficient high-speed crypto processor for 6G
Reconfigurable intelligent processor for 6G technologies and its applications
Design and implementation of UAV wireless communication system for 6G networks
Reconfigurable system in cyber twin for 6G network security
Hardware/software co-design in agile chip development for 6G and its applications
Last date for paper submission: 15 June 2021
First decision (Accept/ Revise): 15 August 2021
Revised submission due date: 30 October 2021
Final decision: 30 December 2021
Prof. Dr. Hamid Reza Karimi
Politecnico di Milano
Department of Mechanical Engineering
via La Masa 1, 20156 Milan, Italy
Email: [email protected]
Google scholar citations : https://scholar.google.co.in/citations?user=YcTS0ZMAAAAJ&hl=en
Prof. Dr. Jari Nurmi
Electrical Engineering Unit
Korkeakoulunkatu 1, 33014 Tampere University
Email: [email protected]
Webpage : https://www.tuni.fi/en/jari-nurmi
Dr. Houbing Song
Department of Electrical Engineering and Computer Science
Embry Riddle Aeronautical University, Florida, United States
Email: [email protected]
Webpage : https://faculty.erau.edu/Houbing.Song
Google scholar citations : https://scholar.google.com/citations?user=iJ_XxxoAAAAJ&hl=en
Associate Professor of Electrical Engineering, University of Malaysia Malaysia,
Email : [email protected]
Google scholar citations : https://scholar.google.com/citations?user=PJXJbm4AAAAJ&hl=en
Dr. G.Kavithaa (Managing Guest Editor)
Department of Electronics and Communication Engineering
Government College of Engineering, Salem, India.
Email : [email protected], [email protected]