Cyber physical Microsystems for signal processing and navigation systems

The advanced industrial system entirely deals with raw information from data statistics , data analysis, it’s interpretation, data visualization techniques which communicates the message clearly and efficiently through smart inertial sensor-based signal processing navigation system with to ensure safe and secure cooperation, and also contribute to new standards and regulations. The development of the Internet of Things will allow the advancement of much time and safety-critical embedded cyber physical systems (CPS). The new challenge of microsystems be to design, processing and interfacing integrated circuits, middleware, software programme and implement highly distributed and connected digital technologies. These technologies will be embedded in a multimode of increasingly autonomous physical components with various dynamics and satisfying multiple critical constraints including security, power efficiency and high performance. Micro and nano-electromechanical devices are hover to change integrated microsystems and provide paradigm shifts in sensing, communication, and navigation. Among them, micro and nano systems enable integrated platforms for environmental and biological sensing, inertial sensing, as well as energy harvesting, and are the building blocks for spectrum processing and timing applications.

This special issue focus on the design and deployment of the next generation of smart sensors which utilize front-end microelectronic, microelectromechanical system, and processing technologies.

Potential topics included, but not limited

• MEMS and NEMS system devices and structures for signal processing
• MEMS in optical signal processing and beamforming for navigation systems · Signal processing technique for integrating MEMS-based low-cost initial unit and GPS in vehicular navigation
• MEMS integration utilizing dynamic neural networks for vehicular navigation
• Wireless signal processing microelectromechanical pressure sensor for harsh environments
• Signal processing technique for improving the accuracy of MEMS sensors in navigation system 
• MEMS inertial-GPS integrated system using wavelet denoising techniques for navigation system 
• Design of an interface circuit for MEMS capacitive sensors for navigation system · Advanced and intelligent interface circuits for capacitive MEMS sensors for navigation system 
• Intelligent sensor technology in autonomous vehicles · Vision based sensors and communication in intelligent transportation system and connected vehicles 
• Intelligent multi sensor modules for intelligent transportation system 
• Intelligent sensors for ubiquitous and low power vehicles speed monitoring
• Applications of signal sensors in vehicle detection 
• Intelligent sensors in machine vision for robot navigation 
• Intelligent sensors in machine vision for application on science and industry
• Vision based sensors for human assistive systems
• Intelligent sensors for satellite navigation and information fusion 
• Intelligent sensors for improving smart home security 
• Intelligent bio sensor for agricultural applications

Important Dates :

Submission of manuscripts: 28 February 2021

Notification to authors: 30 May 2021

Revised version due date: 30 July 2021

Final decision: 30 October 2021

Submission Guidelines :

The papers must be written in English and describe original research which is neither published nor currently under review by any other journal. Notice that extended journal versions of conference papers must be at least 30% different with respect to the original works accepted to the conference. The call and author guidelines for preparation of manuscript can be found at http://www.elsevier.com/locate/micpro.

All manuscripts and any supplementary material should be submitted to the Elsevier online submission system Evise of the MICPRO journal, available at: https://www.evise.com/profile/#/MICPRO/login. Please choose “SI: Signal Processing” from the special issue drop-down list.

Please send all enquiries regarding this Special Issue to the Guest Editors, via e-mail.

Guest Editors:

Dr. I. Hameem Shanavas (Lead Guest Editor), Associate Professor & Head, Department of Electronics and Communication Engineering, M. V. J. College of Engineering, Bangalore, India, Email: shanhameem86@gmail.com

Google scholar citations

https://scholar.google.co.in/citations?user=fa7mS6IAAAAJ&hl=en

Dr.Mohammad Haider
Associate Professor
Department of Electrical and Computer Engineering
The University of Alabama at Birmingham, United States
Email : mrhaider@uab.edu
Google scholar citations
https://scholar.google.co.in/citations?user=BgzWbuQAAAAJ&hl=ko

Dr. Zhiwei Gao,
Associate Professor
Department of Electrical Engineering
Northumbria University, United Kingdom
Email : ZHIWEI.GAO@northumbria.ac.uk
Google scholar citations
https://scholar.google.co.uk/citations?user=n8nkt-0AAAAJ&hl=en
Dr. I. Hameem Shanavas (Lead Guest Editor), Associate Professor & Head, Department of Electronics and Communication Engineering, M. V. J. College of Engineering, Bangalore, India

Email: shanhameem86@gmail.com

Google scholar citations

https://scholar.google.co.in/citations?user=fa7mS6IAAAAJ&hl=en