RFIC 2021 : IEEE Radio Frequency Integrated Circuits Symposium

  in Conferences   Posted on November 3, 2020

Conference Information

Submission Deadline Monday 18 Jan 2021 Proceedings indexed by :
Conference Dates Jun 6, 2021 - Jun 8, 2021
Conference Address Atlanta, United States
Conference & Submission Link https://rfic-ieee.org/
Conference Organizers : ( Deadline extended ? Click here to edit )

Conference Ranking & Metrics (This is a TOP Conference)

Impact Score 2.15
#Contributing Top Scientists 12
#Papers published by Top Scientists 20
Google Scholar H5-index 24
Guide2Research Overall Ranking: 458
Category Rankings
Hardware, Robotics & Electronics 88
Signal Processing 87
Proceedings https://ieeexplore.ieee.org/xpl/conhome/1000611/all-proceedings

Conference Call for Papers

Technical Areas: The symposium solicits papers describing original work in all areas related to RF, millimeter-wave,
THz, and wireless ICs and systems. Work must be demonstrated through IC hardware results and measurements.
 Wireless Radios and Systems-on-Chip: innovative circuit and system-on-chip concepts related to softwaredefined radio, cognitive radio, interference cancellation, full-duplex, advanced SOCs for cellular/WiFi, GPS, lowpower radio circuits for sensors, IoT, Zigbee, biomedical applications, radio architectures suitable for energy
harvesting, wake-up receivers, etc.
 mmWave Communication Circuits and Systems-on-Chip: >20GHz (i.e., mmWave through THz) circuits and
SOCs for wireless communication, including 5G, phase shifters, phased arrays, beamformers, and transceivers.
 Radar, Imager, and Sensor Systems-on-Chip: integrated radar, imaging, spectroscopy, and sensing circuits at
microwave through THz frequencies, including vehicular radar SOCs.
 Transmitters and Power Amplifiers: for RF through mmWave frequencies and higher, power amplifiers, drivers,
modulators, digital transmitters, advanced TX circuits, linearization and efficiency enhancement techniques, etc.
 Front-End Circuits: LNAs, mixers, VGAs, T/R switches, integrated FEM, amplifiers, filters, demodulators.
 Analog and Mixed-Signal Circuits: RF and baseband converters (ADC/DAC), sub-sampling/over-sampling
circuits, converters for digital beamforming, converters for emerging TX and RX architectures, power (DC-DC)
converters for RF applications, I/O transceivers and CDRs for wireline and optical connectivity.
 Oscillators and Frequency Synthesizers: VCOs, injection-locking frequency dividers/multipliers, PLLs, DLLs,
MDLLS, DDS, LO drivers, frequency dividers.
 Device/Packaging/Modeling and Testing Technologies: RF device technology (both silicon and compound
semiconductors) MEMs, integrated passives, photonic, reliability, packaging, modeling and testing, EM
modeling/co-simulation, built-in-self-test (BIST).
 Emerging Circuit Technologies: MEMs-based sensors and actuators, 3D ICs, silicon photonics, quantum
computing ICs, hardware security, novel terahertz solutions, and AI/machine learning applied to RF circuits.
 RFIC System Applications: novel applications of RFICs in communication, biomedical, radar and imaging
systems, calibration, test and measurement, advanced testbeds. May include interactive demonstration and
presentation. Additional details is found on the RFIC website.

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