Sustainable Embedded Software and Systems

  in Special Issue   Posted on August 13, 2017

Information for the Special Issue

Submission Deadline: Sun 15 Oct 2017
Journal Impact Factor : 1.800
Journal Name : Sustainable Computing-Informatics & Systems
Journal Publisher:
Website for the Special Issue: http://www.journals.elsevier.com/sustainable-computing/call-for-papers/special-issue-on-sustainable-embedded-software-and-systems
Journal & Submission Website: http://www.journals.elsevier.com/sustainable-computing

Special Issue Call for Papers:

Scope: As embedded software and systems are closely related to our daily lives and reside anywhere from smart appliances to mobile handheld devices and unmanned trains, they have a significant societal and environmental impact. Therefore, the design and implementation of energy-efficient and sustainable embedded software and systems is of utmost importance.

Embedded software and systems have evolved rapidly in recent years, partially due to advanced communication techniques, emerging processor technologies (such as multicore processors) and new applications of embedded systems (such as Cyber-Physical Systems and Internet of Things). The emergence of these next-generation, smart, and connected systems will inevitably have complex functional requirements, which will have environmental impacts and necessitate new designs and techniques that explicitly consider the close interaction between the systems, users, and application environments. Such requirements and demands pose new challenges in the design and development of effective, energy-efficient, and sustainable embedded software and systems.

This special issue seeks original technical contributions on energy-efficient and sustainable ideas and technologies related to various aspects of designing and developing embedded software and systems, such as novel embedded system architectures, flexible and adaptive scheduling algorithms and system software, new design software and tools, and emerging embedded applications.

Specific topics include, but are not limited to, the following:

  • Energy-Efficient Embedded System Architectures (SoC and Multicore)
  • Energy-Aware Pervasive/Ubiquitous Computing Software and Systems
  • Energy-Aware Cyber-Physical Systems (Automotive, Medical and Avionics Systems)
  • Energy-Efficient Design Methodologies & Tools for Embedded Software and Systems
  • Mobile and Embedded Cloud Computing
  • Energy-Efficient and Sustainable Techniques for Embedded Software and Systems
  • Emerging Energy-Aware Applications and Frameworks for Internet of Things (IoT), Wearable Computing, and Smart Cities

Submission Details:

General information for submitting papers to SUSCOM can be found at http://www.journals.elsevier.com/sustainable-computing/ (please note the “Guide for Authors” link). Submissions to this Special Issue (SI) should be made using Elsevier’s editorial system at the journal website (http://www.journals.elsevier.com/sustainable-computing/, under the “Submit Your Paper” link). Please make sure to select the “SI: Embedded Software and Systems” option for the type of the paper during the submission process. All submissions must be original and may not be under review by another publication. A submission based on one or more papers that appeared elsewhere, such as ICESS 2017, has to comprise major value-added extensions over what appeared previously (at least 30% new intellectual material). Authors are requested to attach to the submitted paper their relevant, previously published article and a summary document explaining the enhancements made in the journal version. All submitted papers will be peer reviewed using the normal standards of SUSCOM. By submitting a paper to this issue, the authors agree to referee one paper (if asked) within the time frame of the SI.

Important Dates:

  • Manuscript due date: October 15, 2017
  • First decision notification: December 15, 2017
  • Tentative publication schedule: Early-2018

Special Issue Editors:

Tam Chantem

Virginia Tech

USA

tchantem@vt.edu

Nan Guan

Hong Kong Polytechnic University

China

csguannan@comp.polyu.edu.hk

Duo Liu

Chongqing University

China

liuduo327@gmail.com

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