Reliability of new Technologies for Power Electronics

  in Special Issue   Posted on June 15, 2019

Information for the Special Issue

Submission Deadline: Sat 30 Nov 2019
Journal Impact Factor : 1.371
Journal Name : Microelectronics and Reliability
Journal Publisher:
Website for the Special Issue: https://www.journals.elsevier.com/microelectronics-reliability/call-for-papers/special-issue-on-reliability-of-new-technologies
Journal & Submission Website: https://www.journals.elsevier.com/microelectronics-reliability

Special Issue Call for Papers:

(Si and Wide Band Gap Devices, Interconnections, Passives, and Applications)
Scheduled Publication Time: July 2020


Guest Editors
Paolo Cova, University of Parma, Italy (paolo.cova@unipr.it)
Francesco Iannuzzo, CORPE, Aalborg University, Denmark (fia@et.aau.dk)

Aims and scope
According to Eurostat (https://ec.europa.eu/eurostat), renewable energy share in the EU was 17.5% in 2017. The current growth in the global share of energy generation and consumption that is electrically based is predicted to accelerate over the coming decades, reaching 70 % in 2050 . Both these amazing results rely completely on power electronics that is needed to convert voltages and frequencies to match the specific application, such as industrial drives, automotive, aerospace and railway transportation. Therefore, power electronics technology is demanded to be more and more reliable to cope with such an impressive trend.
Frontier Silicon-based technologies, such as 3-D integration and smart power devices, wide bandgap semiconductors (WBG), new packaging interconnections, emerging passive technologies, and new concepts, such as disruptive conversion topologies, are capturing increasing interest, even though their reliability performance is still far to be demonstrated. It is generally recognized that electronic equipment is stressed by many factors, including extreme mission profiles, temperature, humidity, vibration, cosmic rays, which lead to the degradation of the components, therefore multidisciplinary knowledge is needed, as illustrated by the triangle in the figure.
Prospective authors are invited to submit original contributions or overview papers for review for publication in this special issue. Topics of interest include, but are not limited to:

• Failure mechanisms in modern power semiconductor devices
• Reliability of advanced interconnections and layout concepts
• Packaging-level reliability
• Reliability of passive components
• Robustness design – design for reliability in present and future power electronics
• Testing for reliability – accelerated tests
• Mission-profile modeling and simulation in power systems
• Optimization for reliability in modern power electronics
• Design of modular/fault tolerant power electronic systems for reliability
• Reliability assessment of disruptive conversion topologies
• Thermal management
• Prognostic methods in power electronics
• WBG Materials – physics and technological issues
• WBG device lifetime modelling and prediction
• Comparison on robustness and reliability performance between Silicon and WBG
• Radiation

Submission instructions
Please ensure you read the Guide for Authors before writing your manuscript. The Guide for Authors and link to submit your manuscript is available on the Journal’s homepage at: https://www.journals.elsevier.com/microelectronics-reliability/
The Microelectronics Reliability’s submission system will be open for submissions to our Special Issue from 01 05 2019. When submitting your manuscript please select the article type “VSI: Reliability of new Power Electronics Technologies”. Please submit your manuscript before 30 11 2019.
All submissions deemed suitable to be sent for peer review will be reviewed by at least two independent reviewers. Once your manuscript is accepted, it will go into production, and will be simultaneously published in the current regular issue and pulled into the online Special Issue. Articles from this Special Issue will appear in different regular issues of the journal, though they will be clearly marked and branded as Special Issue articles.
https://www.sciencedirect.com/journal/microelectronics-reliability/special-issue/10KQH0K6M8P

Deadline for Submission of Manuscript: November 30, 2019

Timeline:

• May 2019 – November 2019 – Announcement and Call for Papers

• November 30, 2019 – Manuscripts Submission Deadline

• February 15, 2020 – First Review Complete

• March 15, 2020 – Revised Manuscripts Due

• April 30, 2020 – Second Review Complete

• July 2020 – Special Issue published on Microelectronics Reliability
 

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