Design, Technology, and Test of Integrated Circuits and Systems

  in Special Issue   Posted on June 3, 2020

Information for the Special Issue

Submission Deadline: Mon 31 Aug 2020
Journal Impact Factor : 1.371
Journal Name : Microelectronics and Reliability
Journal Publisher:
Website for the Special Issue: https://www.journals.elsevier.com/microelectronics-reliability/call-for-papers/design-technology-and-test-of-integrated-circuits-and-system
Journal & Submission Website: https://www.journals.elsevier.com/microelectronics-reliability

Special Issue Call for Papers:

Microelectronics Reliability seeks original manuscripts for a Special Issue on Design, Technology, and Test of Integrated Circuits and Systems scheduled to appear in an issue of 2021.

One of the main challenges for the electronic research field is to cope with the rapidly progressing technology which, today, reaches the nanometer scale. The areas of interest of this Special Issue include the design, test and technology of electronic products, ranging from integrated circuit modules and printed circuit boards to full systems and microsystems, as well as the methodologies and tools used in the design, verification and validation of such products. As a side effect of the device size shrinking, classical computing approaches are no more attractive and novel emerging paradigms technologies are progressively raising interests to the scientific community, which is actually working on: computing-in-memory architectures, approximate computing, evolvable computing, MEMRISTOR based devices and so on.

Topics of the Special Issue include, but are not limited to:

  • Integrated System Design:
    SOC and SIP Design; Multiprocessor systems; Embedded Systems; Wireless Systems; Network on Chip; Neuromorphic Computation; Analog, Mixed Signal and RF Systems; MEMS and MOEMS; Low Voltage and Low Power Systems; Synthesis (physical, logic); Simulation, Validation and Verification; Hardware Security
  • Integrated System Technology:
    Emerging Resistive Memories; Nanoelectronics; Device Modeling; Material Characterization; Failure Analysis; New Components; Packaging; Process Technology; Reliability Issues; Innovative Technologies
  • Integrated System Testing and Reliability:
    Test and Security Issues; Defect and Fault Modeling; Analog and Mixed Signal Testing; MEMS/MOEMS Testing; SOC and SIP Testing; Delay Testing; Memory Testing; Single Event Effect on Electronics; Radiation effects and Radiation Hardening; Fault Simulation, ATPG; DFT, BIST, BISR; On-line Testing; Fault Tolerant Systems; Approximate Computing; Quantum Computing; Alternative Test Strategies

Submission Guideline:

Submitted articles must not have been previously published or currently submitted for journal publication elsewhere. It is mandatory for previous published work to add more than 30% of new material. As an author, you are responsible for understanding and adhering to our submission guidelines. You can access them at the Guide for Authors of Microelectronics Reliability. When submitting papers, please select the Article Type “VSI: DTIS_DDECS” in submission system. Please thoroughly read these before submitting your manuscript.

Important Dates:

Submission deadline: August 31st, 2020

Reviews completed: November 30th, 2020

First round notification: December 1st, 2020

Reviews of revisions: February 10th, 2021

Notification of final acceptance: February 15th, 2021

Publication materials for final manuscripts due: March 10th, 2021

Publication date: May 31st, 2021

Guest Editors

Luigi Dilillo
LIRMM – CNRS/University of Montpellier
161, rue Ada 34095 Montpellier, France
luigi.dilillo@lirmm.fr 

Zoran Stamenkovic
IHP – Leibniz-Institut für innovative Mikroelektronik,
Im Technologiepark 25,
15236 Frankfurt (Oder), Germany
stamenko@ihp-microelectronics.com

Alberto Bosio
Ecole Centrale de Lyon, 36 av. Guy de Collongue, F-69134 Ecully, France
alberto.bosio@ec-lyon.fr

Closed Special Issues