Soldering and Surface Mount Technology

  in Journal   Posted on September 6, 2020

The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches. Among the range of topics covered are:

Soldering science and technology
Novel soldering processes and new solder alloys
Surface mount technology (SMT)
Surface mount assembly
Advanced packaging technologies and 3D interconnects
Flip chip/BGA/SiP/TSV
Novel substrates and embedded components
Solderable finishes and coatings
Screen printing
Conductive adhesives and conformal coatings
Reliability
Quality control
Inspection and testing
Rework and repair
Environmental aspects

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