Soldering and Surface Mount Technology

  in Journal   Posted on August 27, 2017

Journal Ranking & Metrics

JCR Impact Factor: 1.46
SJR : 0.311
Scopus H-index : 25
Guide2Research Overall Ranking: 392

Journal Information

ISSN: 0954-0911
Publisher :
Periodicity : Quarterly
Journal & Submission Website:

Aims & Scope of the Journal

The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches. Among the range of topics covered are:

Soldering science and technology
Novel soldering processes and new solder alloys
Surface mount technology (SMT)
Surface mount assembly
Advanced packaging technologies and 3D interconnects
Flip chip/BGA/SiP/TSV
Novel substrates and embedded components
Solderable finishes and coatings
Screen printing
Conductive adhesives and conformal coatings
Quality control
Inspection and testing
Rework and repair
Environmental aspects

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