TEI 2021 : International Conference on Tangible, embedded, and embodied interaction

  in Conferences   Posted on June 1, 2020

Conference Information

Submission Deadline Friday 24 Jul 2020 Proceedings indexed by :
Conference Dates Feb 17, 2021 - Feb 17, 2021
Conference Address Salzburg, Austria
Conference & Submission Link https://tei.acm.org/2021/
Conference Organizers : ( Deadline extended ? Click here to edit )

Conference Ranking & Metrics (This is a TOP Conference)

Guide2Research Overall Ranking: 175
Category Rankings
Human Computer Interaction 23
Databases & Information Systems 46
Web, Mobile & Multimedia Technologies 33
Hardware, Robotics & Electronics 30
Number of Editions: 15
CORE 2018 Rating: A

Google Scholar H5-index:
25

Conference Call for Papers

ACM TEI 2021 is the 15th annual conference dedicated to presenting the latest results in tangible, embedded, and embodied interaction. TEI 21 will be held on February 14-17, 2021 in Salzburg, Austria.

The ACM International Conference on Tangible, Embedded and Embodied Interaction (TEI) addresses issues of human-computer interaction, novel tools and technologies, interactive art, and user experience. The work presented at TEI has a strong focus on how computing can bridge atoms and bits into cohesive interactive systems. The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations, and performances.

The theme for TEI2021 is The Art of Interaction, inviting all participants and in particular artists to speculate on a vision of how art impacts, inspires and shapes our research practice. We consider art and the artistic method an important aspect for tangible interaction design, ranging from physical to digital works across all genres, such as interactive installations, performance art, and tangible sculptures. TEI2021 will therefore focus on the further development of the art & performance track and foster the artistic method through a dedicated artist residency program in Linz and Salzburg.

Authors are invited to submit high-quality papers that contribute to advancing this rapidly developing field. The length of a submission should be commensurate with its contribution. The shortest version of your paper is probably the best.

We highlight the following non-exclusive set of contribution types:

Artefact: We welcome submission of research artefacts that advance the state of the art in Tangible, Embedded and Embodied Interaction. Artefacts can demonstrate new technologies (e.g., new sensing techniques or algorithms), new forms of input (e.g., novel interaction techniques) or new designs (e.g., provocative or evocative objects, systems or services).

Method: Tools, approaches and techniques that enable researchers, technologists, designers and practitioners to study, research and work on Tangible, Embedded and Embodied Interaction. Methods can include new forms of study design or data analysis, new engineering processes or frameworks that can structure and constrain generative design activity.

Theory: Explorations, extensions, refutions, instantiations and other developments of and to the theories pertaining to Tangible, Embedded and Embodied Interaction, such as theories of cognition or the mind and designerly theories and conceptual frameworks.

Empirical: Studies and data that add to our understanding of Tangible, Embedded and Embodied Interaction by, for example, providing quantitative accounts of salient aspects of human performance or qualitative characterizations of experiences with tangible artefacts and systems. Empirical submissions can detail outcomes from a very wide range of lab, field and online studies.

Respecting the diversity of approaches and methods that together make up TEI, each contribution type will be peer-reviewed on its own merits. We seek high-quality work regardless of the specific subdomain or topic and we expect the work to be positioned firmly in, and building on, prior research in our field, in particular wherever relevant referencing work that was presented at earlier TEI conferences.

Accepted submissions of all contribution types will be included as papers in the conference proceedings, which will be available in the ACM Digital Library.

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