INTERCON 2020 : IEEE XXVII International Conference on Electronics, Electrical Engineering and Computing

  in Conferences   Posted on June 1, 2020

Conference Information

Submission Deadline Tuesday 30 Jun 2020 Proceedings indexed by :
Conference Dates Sep 3, 2020 - Sep 5, 2020
Conference Address Online, Online
Conference & Submission Link
Conference Organizers : ( Deadline extended ? Click here to edit )

Conference Call for Papers

The 2020 IEEE XXVII International Conference on Electronics, Electrical Engineering and Computing – INTERCON aims to bring together researchers, professionals, students and entrepreneurs to facilitate the approach, identification and commitment to join challenges that allow the development of technologies for the benefit of humanity.


Topics of interest include, but are not limited to:

Communication systems

Semiconductor and devices

Computers and information technology

Signal processing

Systems and control

Emerging technologies

Circuits and systems

Power generation, transmission and distribution

Renewable energy sources, smartgrids technologies and applications

Power electronics, systems and applications

Electrical machines and adjustable speed drives

High voltage engineering and insulation technology

Algorithms and complexity

Architecture and organization

Graphics and visualization

Information management, assurance and security

Intelligent systems

Parallel and distributed Computing

Software engineering

Social issues and professional practice


The official language of INTERCON is ENGLISH. The maximum number of authors per paper is four (4). Papers must be submmited in PDF and no longer than four (4) pages, following the IEEE Conference Template available at:

We will use EasyChair system for submissions here:


Every accepted paper will need one associated full registration for being included in the conference technical program and proceedings.


As it is mandatory for any IEEE conference, we will implement a strict “No Show No Publication” policy, meaning that accepted papers that are not presented at the conference will not be submitted for publication in IEEE Xplore. Such presentations must be done virtually, so participants and authors can talk and interchange their experiences and views. Technical discussions are a precious element of quality of our conference.

All the papers submitted through EasyChair will be peer reviewed and all of the accepted papers, if they are presented at 2020 INTERCON, will be submitted for publication in IEEE Xplore.

Organizing Committee

Conference Chair:

César Gallegos

Technical Program Chair:

Carlos Silva

Publication Chair:

José Durán

Conference Treasurer:

Carlos Chancafe

Information Contact:

Eyner Mesones

Sponsored by: IEEE Peru Section (

Supported by: Tecsup Lima IEEE Student Branch

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