EMSOFT 2019 : International Conference on Embedded Software

  in Conferences   Posted on February 3, 2019

Conference Information

Submission Deadline Friday 12 Apr 2019 Proceedings indexed by :
Conference Dates Oct 13, 2019 - Oct 18, 2019
Conference Address New York City, United States
Conference & Submission Link http://www.esweek.org/emsoft/about
Conference Organizers : ( Deadline extended ? Click here to edit )

Conference Ranking & Metrics (This is a TOP Conference)

Guide2Research Overall Ranking: 268
Category Rankings
Software Engineering & Programming 79
Hardware, Robotics & Electronics 44

Google Scholar H5-index:
19

Conference Call for Papers

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EMSOFT 2019

Call for Papers

International Conference on Embedded Software

October 13 – October 18, 2019, New York City, USA

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The ACM SIGBED International Conference on Embedded Software (EMSOFT)

brings together researchers and developers from academia, industry, and

government to advance the science, engineering, and technology of embedded

software development. Since 2001, EMSOFT has been the premier venue for

cutting-edge research in the design and analysis of software that

interacts with physical processes, with a long-standing tradition for

results on cyber-physical systems, which compose computation, networking,

and physical dynamics.

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Timeline

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Journal-Track Submissions

– Abstract: April 5, 2019

– Full Paper: April 12, 2019 (firm)

Work-in-Progress Submissions

– June 7, 2019 (firm)

Notification of Acceptance

– July 10, 2019 (both tracks)

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Topics of Interests / Tracks

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Submissions are invited on all aspects of embedded software systems,

including but not limited to:

* Embedded software design and analysis

* Formal modeling and verification

* Testing, validation, and certification

* Model- and component-based approaches

* Embedded Operating systems and middleware

* Embedded distributed, networked systems

* Embedded software on multi- and many-core processors

* Safety-critical and mixed-critical embedded soft-ware design

* Time-critical embedded systems

* Scheduling and execution time analysis

* QoS management and performance analysis

* Energy-efficient embedded software

* Embedded software security

* Embedded software architectures for intensive data and signal processing

* Software design for cyber-physical systems

* Robust implementation of control systems

* Empirical studies and their reproduction

* Application areas including automotive, avionics, energy, health care,

mobile devices, multimedia, machine learning, and autonomous systems

A special day focusing on the Internet of Medical Things will be organized

jointly by all conferences in ESWEEK. Papers aligned to the topics of

interest for EMSOFT, focusing on Medical Cyber-Physical Systems with an

emphasis on software for health care are welcome.

Papers should represent original work, not formerly published or submitted

for publication in other forums. A blind review process will be enforced.

Authors should not reveal authorship directly or indirectly through

references.

EMSOFT will follow a two-stage review process, where papers passing the

first stage of reviews will be asked to revise their work based on

reviewer comments within a short time frame of around two weeks. Accepted

papers will participate in the direct journal publication track and

appear in ACM TECS (see below).

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Paper Process

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EMSOFT 2019 has a dual publication model where papers will be published

in two tracks: Journal track papers will be published in the ACM

Transactions on Embedded Computing Systems (TECS) and Work-in-Progress

track papers will be published in the ESWEEK Proceedings.

More details at https://www.esweek.org/author-information.

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Organization

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EMSOFT Program Chairs:

Sriram Sankaranarayanan, U. of Colorado Boulder, USA

Timothy Bourke, Inria Paris, France

ESWEEK General Chairs:

Petru Eles, Linköping University, SE

Tulika Mitra, National University of Singapore, SG

www.esweek.org

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