EMSOFT 2018 : ACM International Conference on Embedded Software

  in Conferences   Posted on February 18, 2018

Conference Information

Submission Deadline Tuesday 27 Mar 2018
Conference & Submission Link http://www.esweek.org/emsoft/about
Conference Dates Sep 30, 2018 - Oct 5, 2018
Conference Address Torino, Italy
Proceedings indexed by
Conference Organizers : ( Deadline extended ? Click here to edit )

Conference Ranking & Metrics (This is a TOP Conference)

Google Scholar H5-index: 19
CORE 2017 Rating: A
Guide2Research Overall Ranking: 257
Category Rankings
Software Engineering & Programming 68
Hardware, Robotics & Electronics 41

Conference Call for Papers

Submissions to EmSoft2018 should be made from the site: (Link Coming Soon!)(for abstract, regular and WiP papers altogether, at due times). EmSoft is part of ESWeek and, as such, will follow the submission and selection rules described below.

ESWEEK 2018 introduces a dual publication model comprising two tracks, namely the Journal track and the Work-in-Progress (WiP) track. Journal-track papers, which are full-length (10-page) papers describing mature work, will be published in IEEE TCAD. The WiP-track papers, which are short (2-page) papers representing not-yet-mature but promising research work, will be published in the ESWEEK proceedings and will be listed as regular publications within the ACM and/or IEEE digital libraries. Authors of WiP papers have the opportunity to publish the extended final form of their work when it has matured in any conference or journal they prefer. Journal papers and WiP papers are mutually exclusive, i.e., a work can only be in submission in one of the two tracks.

For publication of all accepted papers, in both the journal and WiP tracks, the following is required:

One full, regular ESWEEK registration per paper
An in-person paper presentation at one of the conferences
A poster presentation

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