ATVA 2019 : International Symposium on Automated Technology for Verification and Analysis

  in Conferences   Posted on February 10, 2019

Conference Information

Submission Deadline Friday 03 May 2019 Proceedings indexed by :
Conference Dates Oct 28, 2019 - Oct 31, 2019
Conference Address Taipei, Taiwan
Conference & Submission Link http://atva2019.iis.sinica.edu.tw/
Conference Organizers : ( Deadline extended ? Click here to edit )

Conference Ranking & Metrics (This is a TOP Conference)

Guide2Research Overall Ranking: 286
Category Rankings
Software Engineering & Programming 83
Databases & Information Systems 74
Number of Editions: 18 ( since 2003 )
CORE 2018 Rating: A
DBPL Proceedings

Google Scholar H5-index:
18

Conference Call for Papers

ATVA 2019 is the 17th in a series of symposia aimed at bringing together academics, industrial researchers and practitioners in the area of theoretical and practical aspects of automated analysis, synthesis, and verification of hardware and software systems. ATVA solicits high quality submissions in the following suggestive list of topics:

* Formalisms for modeling hardware, software and embedded systems

* Specification and verification of finite-state, infinite-state and parameterized system

* Program analysis and software verification

* Analysis and verification of hardware circuits, systems-on-chip and embedded systems

* Analysis of real-time, hybrid, priced, weighted and probabilistic systems

* Deductive, algorithmic, compositional, and abstraction/refinement techniques for analysis and verification

* Analytical techniques for safety, security, and dependability

* Testing and runtime analysis based on verification technology

* Analysis and verification of parallel and concurrent systems

* Verification in industrial practice

* Synthesis for hardware and software systems

* Applications and case studies

* Automated tool support

ATVA welcomes submissions in the following two categories:

* Regular research papers (16 pages, including references)

* Tool papers (6 pages, including references)

For further details, please visit the conference website.

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