AI3D 2019 : Second International Workshop on Artificial Intelligence for 3D Big Spatial Data Processing

  in Conferences   Posted on June 7, 2019

Conference Information

Submission Deadline Sunday 22 Sep 2019 Proceedings indexed by :
Conference Dates Dec 9, 2019 - Dec 11, 2019
Conference Address San Diego, United States
Conference & Submission Link https://sites.google.com/view/ai3d2019/home
Conference Organizers : ( Deadline extended ? Click here to edit )

Conference Call for Papers

Second International Workshop on Artificial Intelligence for 3D Big Spatial Data Processing (AI3D 2019)

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Co-located with IEEE ISM 2019, San Diego, California, USA, December 9-11, 2019

Weblink: https://sites.google.com/view/ai3d2019/home

Recent advances in laser technology has evolved the importance of 3D spatial data and challenges considering is processing and management. 3D spatial data is usually generated as a stream of points by mounting scanning equipment on drones and cars for large area scanning or on some stationary platform for small area scanning or indoor scanning. The 3D spatial data offer a useful source of information for natural resource management, urban planning, autonomous driving, etc.

Artificial intelligence (AI) has the potential to take the 3D spatial data processing into hypergrowth. Recently, 3D indoor mapping systems, terrestrial mobile mapping systems (MMS) and airborne LiDAR systems are capable of collecting terabytes of data (including images and point clouds) in a single scan or on a single trip. Existing approaches and tools lack the efficient management, processing and analysis of 3D spatial data. The solution to this problem lies in the use of Artificial Intelligence and

Deep Learning to redefine the workflow.

This workshop focuses on the use of Artificial Intelligence and Deep Learning to improve the processing, management and analysis of 3D Big Spatial data. The workshop aims at providing a platform to the group of researchers working in this direction to share their work, exchange ideas, and solve research problems.

Topics of Interest

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A list of topics of interest includes but is not limited to:

AI and the 3D scanning technologies and devices

Use of AI in 3D view registration and surface modeling

Intelligent LiDAR data processing, management and analysis

Point cloud data processing and analysis

Spatio-temporal data processing and analysis

Geo spatial data processing and analysis

Distributed, parallel and peer-to-peer approaches to index, search and process 3D Big spatial data

AI based object detection from point cloud and images

Supervised/Unsupervised object annotation in 3D data

Point cloud data indexing and querying

3D Big spatial data architectures

3D Big spatial data visualization and analytics

3D Big spatial data cleaning, compression and integration

Geographic Information Retrieval

Indoor and outdoor mapping

3D mapping

Urban Planning

Spatial data applications

User Interfaces and Visualization

Submission Instructions and Review Process

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Authors are invited to submit an 8-page (regular), 4-page (short), and 2-4 page (vision or on-going) manuscript in double-column IEEE format. Manuscripts must be written

in English and follow the instructions in the Manuscript Formatting and Templates page.

Document templates are located at:

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Word (http://media.wix.com/ugd/346a54_3feb3b10846a4532951e3fcae6767fae.doc?dn=MSW_USltr_format%20(2).doc)

LaTeX (http://ism2017.asia.edu.tw/wp-content/uploads/2017/01/ieeetran5.zip)

LaTeX (Bibliography Files) (http://ism2017.asia.edu.tw/wp-content/uploads/2017/01/ieeetranbst1.zip)

All paper submissions will be carefully reviewed by at least three experts and reviews will be returned to the author(s) with comments to ensure the high quality of the accepted papers. The authors of accepted papers must guarantee that their paper will be presented at the workshop. Please only submit original material where copyright of all parts is owned by the authors declared and which is not currently under review elsewhere. Please see the IEEE policies for further information.

Manuscript Submission Instructions:

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Only electronic submission will be accepted. Technical paper authors MUST submit their manuscripts through EasyChair. Manuscripts may only be submitted in PDF format.

Camera-ready Submission Instructions:

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Your final papers MUST be formatted to IEEE Computer Society Proceedings Manuscript Formatting Guidelines (see the templates listed earlier). It is highly recommended that you proofread and check the layout of your paper BEFORE submitting.

Note:

Every paper accepted for publication in the Proceedings MUST be presented during the workshop.

Every paper accepted MUST have attached to it at least one registration at the full member/nonmember rate. Thus, for a paper for which all authors are students, one student author will be required to register at the full registration rate. Failure to do so will result in removal of your paper from the conference proceedings. Regular workshop papers allow up to 2 extra pages and short papers up to 1 extra page with $150 per extra page.

Contribution Types:

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Full research paper: 8 pages

Short research paper: 4 pages

Vision or on-going research paper: 2-4 pages

Key Dates:

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Paper submission deadline: September 22, 2019

Notification of acceptance: October 21, 2019

Camera ready deadline: October 31, 2019

Workshop date: December 9, 2019

Organization Committee

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General Co-Chairs:

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Prof. Dr. Sisi Zlatanova, UNSW, Australia

Dr. Kyoung-Sook Kim, AIRC, AIST, Japan

Program Co-Chairs:

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Dr. Salman Ahmed Shaikh, AIRC, AIST, Japan

Dr. Jun Lee, AIRC, AIST, Japan

PC Members:

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Prof Dr. Liangliang Nan, TU Delft, Netherlands

Prof. Dr. Adam Jatowt, Kyoto University, Japan

Dr. Akiyoshi Matono, AIRC, AIST, Japan

Dr. Jianquan Liu, NEC, Japan

Prof. Dr. Omar Arif, NUST, Pakistan

Prof. Dr. Mohsin Memon, MUET, Pakistan

Dr. Savong Bou, Toyota Technological Institute, Japan

Dr. Chidchanok Choksuchat, Prince of Songkla University, Thailand

Dr. Yuyang Dong, NEC, Japan

More to be added

For any query, contact us at: ai3d2019-ml@aist.go.jp

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